pb lead-free parts lsrfvg3392/s82-pf 17 - oct. - 2006 doc. no : qw0905- rev. : a date : data sheet ligitek electronics co.,ltd. property of ligitek only dual color led lamps lsrfvg3392/s82-pf
18.0min 1 2 3 2.0min 0.5 typ 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -30 -60 directivity radiation 30 60 0 2.54typ 2.0min 1.cathode green 2.common anode 3.cathode red 3 2 1 - + - 1.5max part no. lsrfvg3392/s82-pf package dimensions 5.9 5.0 10.5 0.5 8.6 7.6 vg srf page 1/6 ligitek electronics co.,ltd. property of ligitek only 50% 100%75%50% 0 25%25%100% 75%
i f forward current 30 ma 30 power dissipation peak forward current duty 1/10@10khz reverse current @5v storage temperature part no typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. lsrfvg3392/s82-pf operating temperature spectral halfwidth nm 20 30 color white diffused algainp gap red green material emitted ---- 565 ---- 630 peak wave length pnm lens dominant wave length dnm 2.4 2.6 1.5 1.7 9.0 3.0 15.0 5.0 forward voltage @20ma(v) max. min. luminous intensity @20ma(mcd) min. typ. 76 76 viewing angle 2 1/2 (deg) -40 ~ +100 -40 ~ +85 tstg t opr pd ir i fp 75 90 ma mw a 120 100 10 absolute maximum ratings at ta=25 ratings ligitek electronics co.,ltd. property of ligitek only parameter symbol srf unit page vg 2/6 electrostatic discharge( * ) esd 2000 v ---- static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * lsrfvg3392/s82-pf part no.
ambient temperature( ) fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -2020 04060 0.9 1.0 1.2 1.1 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.0 80100-40-20 020 3.0 2.5 2.0 1.0 1.5 0.5 100 60 4080 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage srf chip f o r w a r d c u r r e n t ( m a ) forward voltage(v) 0.1 1.02.0 1.0 10 3.04.0 100 1000 forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.5 1.0 0.5 0.0 5.01.010 3.0 2.5 2.0 1001000 ligitek electronics co.,ltd. property of ligitek only fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 550 0.0 0.5 650 1.0 700 3/6 page lsrfvg3392/s82-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 4/6 page lsrfvg3392/s82-pf part no.
dip soldering preheat: 120 c max preheat time: 120seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 100 0 0 preheat 25 120 2 /sec max 250 200 time(sec) 260 temp( c) 5 /sec max 260 c3sec max page 5/6 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only 120 seconds max lsrfvg3392/s82-pf part no.
1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec solderability test solder resistance test thermal shock test high temperature high humidity test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test test item reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 description reference standard ligitek electronics co.,ltd. property of ligitek only page 6/6 lsrfvg3392/s82-pf part no.
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